page 1 formosa ms fm220-mt thru fm2200-mt document id issued date revised date revision page. ds-12162b 2009/02/10 2011/12/02 c 7 1 2 2 2 2 3 4 4 4 5 6 6 7 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings ............................................................................. rating and characteristic curves........................................................ pinning information........................................................................... marking........................................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing.................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... mechanical data............................................................................... chip schottky barrier rectifier http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141
page 2 2.0a surface mount schottky barrier rectifiers - 20v-200v parameter conditions forward rectified current forward surge current reverse current diode junction capacitance storage temperature see fig.1 8.3ms single half sine-wave (jedec methode) f=1mhz and applied 4v dc reverse voltage symbol min. typ. max. unit i o i fsm i r c j t stg a a ma o c pf 2.0 50 0.2 +175 -65 fm220-mt fm230-mt fm240-mt 20 30 40 14 21 28 20 30 40 -55 to +125 symbols v rrm (v) v rms v r (v) (v) *1 *2 *3 *1 repetitive peak reverse voltage *2 rms voltage *3 continuous reverse voltage *4 maximum forward voltage@i =2.0a f v = v t = 25 c r rrm j o v = v t = 100 c r rrm j o 160 10 v f (v) *4 FM250-MT fm260-mt 50 60 35 42 50 60 0.70 0.50 -55 to +150 fm280-mt fm2100-mt 0.85 80 100 80 100 56 70 formosa ms chip schottky barrier rectifier (c) o operating temperature t, j http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. low profile surface mounted application in order to optimize board space. low power loss, high efficiency. high current capability, l ultra high-speed switching. silicon epitaxial planar chip, metal silicon junction. lead-free parts meet environmental standards of mil-std-19500 /228 features ? tiny plastic smd package. ow forward voltage drop. high surge capability. guardring for overvoltage protection. suffix "-h" indicates halogen-free part, ex.fm220-mt-h. ? ? ? ? ? ? ? ? ? ? mechanical data epoxy : ul94-v0 rated flame retardant case : molded plastic, terminals :plated terminals, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any ? ? ? ? ? ? sod-123t / mini sma weight : approximated 0.018 gram package outline ds-12162b 2009/02/10 2011/12/02 c 7 maximum ratings and electrical characteristics (at t =25 a o c unless otherwise noted) 0.067(1.7) 0.051(1.3) 0.156(3.9) 0.140(3.5) 0.075(1.9) 0.060(1.5) dimensions in inches and (millimeters) sod-123t 0.040 (1.0) 0.024 (0.6) 0.080(2.0) 0.096(2.4) 0.008(0.20)typ. 0.012(0.3) typ. 0.052(1.3) 0.036(0.9) 0.064(1.6) 0.048(1.2) 0.036(0.9) 0.020(0.5) 0.024(0.6)typ. 0.0375(0.95) 0.0296(0.75) 0.044(1.10) 0.028(0.70) fm2150-mt 150 150 105 fm2200-mt 200 200 140 0.90 0.92 fm220-mt thru fm2200-mt thermal resistance r ja o c/w 84 junction to ambient r jc 42 junction to case o c/w
page 3 rating and characteristic curves (fm220-mt thru fm2200-mt) http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-12162b 2009/02/10 2011/12/02 c 7 fig.1-typical forward current derating curve average for ward current ,(a) 0.4 0.8 1.2 1.6 2.0 2.4 fm220-mt~fm240-mt FM250-MT~fm2200-mt lead temperature,( c) 0 0 20 40 60 80 100 120 140 160 180 200 fig.3-maximum non-repetitive forward surge current 0 20 10 30 50 40 number of cycles at 60hz 110 5 50 100 t =25 c j 8.3ms single half sine wave jedec method peak for ward surge current ,(a) fig.4-typical junction capacitance reverse voltage,(v) junction cap acitance,(pf) 700 600 500 400 300 200 100 0 .01 .05 .1 .5 1 5 10 50 100 fig.5 - typical reverse characteristics reverse leakage current , (ma) 0.001 0.01 0.1 1.0 100 10 0 percent of rated peak reverse voltage,(%) 20 40 60 80 100 20v~40v 50v~200v t25c j = t 100 c j = 0.1 1.0 .01 10 50 instantaneous for ward current ,(a) forward voltage,(v) pulse width 300us 1% duty cycle .1 .3 .5 .7 .9 1.1 1.3 1.5 3.0 t =25 c j fig.2-typical forward characteristics 20v ~ 40v 50v ~ 60v 80v ~ 100v 150v~200v
marking type number marking code fm220-mt 22 fm230-mt 23 fm240-mt 24 FM250-MT 25 fm260-mt 26 fm280-mt 28 fm2100-mt 20 fm2150-mt 215 fm2200-mt 220 page 4 formosa ms chip schottky barrier rectifier http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. pinning information 1 2 2 1 pin1 cathode pin2 anode pin simplified outline symbol suggested solder pad layout ds-12162b 2009/02/10 2011/12/02 c 7 suggested solder pad layout fm220-mt thru fm2200-mt dimensions in inches and (millimeters) 0.041 (1.05) 0.041 (1.05) 0.083 (2.10) 0.024 (0.60) 0.056 (1.40) 0.048 (1.20) 0.040(1.00) 0.037 (0.95) 0.016 (0.40)
packing information p 0 p 1 e b d f w p a d d 1 d 2 w 1 c t page 5 formosa ms chip schottky barrier rectifier http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. item tolerance sod-123t carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 - 178.00 - 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. 1.90 3.90 1.68 ds-12162b 2009/02/10 2011/12/02 c 7 fm220-mt thru fm2200-mt
page 6 formosa ms chip schottky barrier rectifier http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. reel packing sod-123t 7" 2,500 4.0 25,000 183*183*123 178 382*262*387 200,000 9.5 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <3 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 3.reflow soldering 10~30sec 1.storage environment: temperature=5 ~40 humidity=55% 25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature ds-12162b 2009/02/10 2011/12/02 c 7 fm220-mt thru fm2200-mt
page 7 formosa ms chip schottky barrier rectifier http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-12162b 2009/02/10 2011/12/02 c 7 fm220-mt thru fm2200-mt 1. solder resistance 2. solderability 3. high temperature reverse bias 4. forward operation life 5. intermittent operation life 6. pressure cooker 7. temperature cycling 8. forward surge 9. humidity 10. high temperature storage life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. v =80% rate at t =125 for 168 hrs. rated average rectifier current at t =25 for 500hrs. t = 25 c, i = i on state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c c c c cc c c o o o o o oo o o rj a afo sig a a o mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 mil-std-750d method-1027 mil-std-750d method-1036 mil-std-750d method-1051 mil-std-750d method-4066-2 mil-std-750d method-1021 mil-std-750d method-1031 jesd22-a102 item test conditions reference high reliability test capabilities
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